Názor k článku AMD chystá facelift highendového čipsetu, X570S pasivně chlazený? Zen3+ naopak nebude od mikymauz - Doplnění - takto to cca proběhlo několika odbornými...

Doplnění - takto to cca proběhlo několika odbornými weby: "TSMC states that their N6 fabrication technology offers 18% higher logic density when compared to the company’s N7 process (1st Gen 7 nm, DUV-only), yet offers the same performance and power consumption. Furthermore, according to TSMC N6 'leverages new capabilities in extreme ultraviolet lithography (EUVL)' gained from N7+, but does not disclose how exactly it uses EUV for the particular technology. Meanwhile, N6 uses the same design rules as N7 and enables developers of chips to re-use the same design ecosystem (e.g., tools, etc.), which will enable them to lower development costs. Essentially, N6 allows to shrink die sizes of designs developed using N7 design rules by around 15% while using the familiar IP for additional cost savings." Omlouvám se za copy/paste.