Odpovídáte na názor k článku Intel zřejmě přiznal, že jeho 1,8nm křemíková technologie je horší než 2nm proces od TSMC. Názory mohou přidávat pouze registrovaní uživatelé.
Installation of the first 150,000-kilogram (331,000-pound) system required 250 crates, 250 engineers and six months to complete
Because of their anamorphic optics, EXE systems have exposure fields half the size of their NXE predecessors. It therefore takes twice as many exposures to pattern a single wafer.
Twice as many exposures could have meant twice as long to print a wafer. Instead, we took it as a challenge. The solution? Much faster wafer and reticle stages. The wafer stage in an EXE system accelerates at 8g, twice as fast as the NXE’s wafer stage. And the EXE’s reticle stage accelerates four times faster than the NXE’s – 32g, the equivalent of a race car going from 0 to 100 km/h in 0.09 seconds.
(https://www.asml.com/en/news/stories/2024/5-things-high-na-euv)