The TSMC 6nm process node was unveiled last year in the company's latest roadmap. Codenamed as 'N6', the TSMC 6nm process will make use of an advanced version of the EUV lithography tech. It will offer an 18% increased in logic density over TSMC's 7nm (N7) process and is compatible with 7nm design which is stated to shorten the time its takes to market consumer products. ... takže to vypadá v podstatě na N7+